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 - Anodizing process
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 - Aqua regia (aqua regis)
 - Auxiliary anodes
 - Auxiliary cathodes
 - Bad
 - Ball impact test
 - Ball indentation according to Erichsen
 - Barrel goods
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 - Basic exposure values
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 - Black chromating
 - Black surface
 - Black oxidation of stainless steel
 - Black oxidizing stainless steel
 - Blasting media
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 - Bright chrome plating
 - Brightener and brightener additive
 - Bound cyanide
 - Burning
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 - Carbonitriding layers
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 - Casting
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 - Cost Engineering
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 - Coulometric layered ceiling measuring method
 - Covering capacity
 - Copper (CU)
 - Copper plating
 - Copper-nickel coating
 - Co-deposition of hydrogen
 - CO2 pellets
 - CO2 snow
 - CO2 snow blasting
 - Cracked or torn surfaces
 - Cracks
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 - Cryo
 - Cryogenic process
 - Current density
 - Current density-potential curve / current voltage curve
 - Current yield
 - Cutoff wavelength (profile filter)
 - CVD process - Chemical Vapor Deposition
 - Cyanides
 - Cyanogen, dicyanogen (CN)2
 - Cyantesmo test paper
 - Deposition rate
 - Deionised water
 - Decapitation
 - Demineralised water
 - Depolarisation
 - Distillation
 - Diaphragm
 - Diffusion
 - Diffusion layer
 - Dip Coating
 - Dispersion
 - Dispersion deposition
 - Dissociation
 - Double layer (electrochemical)
 - Ductility
 - Decorative coatings
 - Design-to-cost
 - Ductile - Ductility
 - Ductile surface
 - Duplex system
 - Degreasing
 - Deburring
 - Decoating
 - Dezincification
 - Descaling
 - Designing for electroforming
 - DC sputtering
 - Dimensional coating
 - Dry ice blasting
 - Drying
 - Dimensional Tolerance
 - Demineralised water
 - Etching
 - Evaporation in a high vacuum
 - External currentless metal separation
 - Electroless nickel / electroless nickel plating
 - Electroless nickel solderable
 - Electroless low phosphorus
 - Electrical conductivity
 - Electrical layer testing
 - Electrochemical deposition
 - Electrode potential
 - Electrolysis
 - Electrolyte
 - Electrolytic degreasing
 - Electrolytic deburring
 - Electrolytic derusting
 - Electrolytic polishing
 - Electrolytic hardening
 - Electrolyte monitoring
 - Electron Microscope
 - Electropolishing of metal surfaces
 - Electrocoating
 - Electroless Nickel (EN)
 - Electroplating (a.k.a. electroplating)
 - Electroplated nickel bright / bright nickel
 - Electroplating
 - Engraving
 - Electroless metal deposition
 - Efficiency
 - Embrittlement
 - Flaking
 - Filling porous workpieces
 - Faraday's laws
 - Fast Speed Plating / High Speed Plating
 - Functional coatings
 - Food-safe surface
 - Friction tinning or galling
 - Germination
 - Gloss level surface
 - Glass bead blasting
 - Galvanic potential
 - Galvanic forming
 - Gas chromatography (GC)
 - Gas phase cleaning
 - GFC
 - Gloss
 - Gloss range
 - Gloss formation
 - Gloss measurement of coating films
 - Glass metallization
 - Glow discharge
 - Gold
 - Gradient layer
 - Green chromating
 - Grinding
 - Grinding method
 - Gilding
 - Goods carrier
 - Galvanising
 - Hard and wear resistant surface
 - Hardness
 - Hardening
 - Hard chrome plating
 - Hull cell
 - High Phosphorus
 - Hardness grade of surface
 - Hollow microspheres
 - Hydrogen embrittlement
 - Iron
 - Initial sample test report
 - Inert surface
 - Infrared spectroscopy
 - Inhibitor
 - Internal stress
 - Intercrystalline corrosion
 - Ions
 - Ionise
 - IR drying
 - Improved abrasion resistance
 - Improvement of chemical resistance
 - Improving gloss level
 - Improving corrosion protection
 - Improving conductivity Aluminum
 - Improvement of solderability
 - Improving UV resistance
 - Interface
 - Interfacial mixing
 - KTL
 - Levelling
 - Limit concentrations
 - Lapping
 - Laser
 - Light microscope
 - Local element
 - Layer testing (electrical)
 - Low phosphorus
 - Layer thickness of thick film passivation
 - Making aluminium components conductive
 - Mandrel bending test
 - Magnesium (Mg)
 - Magnetic abrasive finishing
 - Magnetron sputtering
 - MAK value
 - Manganese (Mn)
 - Machinery Directive
 - Masking
 - Mechanical coating film properties
 - Mechanical tests
 - Medium-solid lacquers
 - Multi-component lacquers
 - Metallic effect paints
 - Metallography
 - Metal organic CVD
 - Metallic pigments
 - Microhardness according to Fischer
 - Micrometer
 - Microwave drying
 - Minicoat and Maxicoat processes → Powder sintering processes
 - Möbius cell
 - Modified alcohols
 - Mohs hardness
 - Molecular weight
 - Molybdenum (Mo)
 - MOS
 - Multilayer technology
 - Multilayer coating
 - Mercury (Hg)
 - Nanometre - nm
 - Nanoparticles
 - Nanotechnology
 - Neutral degreasing
 - Neutralisation
 - Neutral cleaner
 - Non-ionic surfactants
 - Nickel (Ni)
 - Nickel Phosphorus
 - NiP
 - Nitrocarburi layers
 - Nickel plating
 - Ohm's law
 - Orange peel effect
 - Orange peel texture
 - Organic coatings
 - Organic solvents for metal cleaning
 - Osmosis
 - Oxidation or oxidizing
 - Pickling
 - Pickling degreaser
 - Pickling inhibitors
 - Pickling brittleness
 - Printed circuits
 - Primers
 - Plastic electroplating
 - Pitting corrosion
 - Palladium
 - Partial anodizing / anodizing
 - Passivity
 - Patina
 - PECVD (PACVD)
 - Periodic table of the elements
 - Peroxides
 - pH value
 - Phenolic resins
 - Phosphating
 - Photoprinting / photo printing
 - Photoinitiators / Photoinitiators
 - Photometry
 - Physically drying coatings
 - PIBD Plasma asisted IDN Beam Deposition = Ion Beam Deposition
 - Pigments
 - Pitting
 - Plasma
 - Plasma Activation
 - Plasma etching
 - Plasma CVD
 - Plasma diffusion, plasma heat treatment
 - Plasma polymerization
 - Plasma-PVD (Plasma-Physical-Vapour Deposition)
 - Plunge grinding
 - Plasticiser
 - Post-treatment in electroplating
 - Ply corrosion
 - Racks
 - REACH
 - Rectifier
 - Redox potential
 - Red rust
 - Reference electrode
 - Residual stress
 - Rockwell hardness test
 - RoHS compliant
 - Roller burnishing
 - Roughness profile (R-profile)
 - Rust
 - Rust surface / coating
 - Reverse osmosis
 - Sliding properties
 - Shine
 - Smoothing depth Rp
 - Smooth rolling
 - Surface-active substances
 - Surface adhesion
 - Solderable coating
 - Solid solutions
 - Surface activation
 - Surface abrasion resistant
 - Surface chemically unstable
 - Surface gloss
 - Surface does not adhere
 - Surface not tacky
 - Surface not solderable
 - Surface bursts and/or cracks
 - Surface hardness too low or increase on aluminium, non-ferrous metal, steel.
 - Surface roughness testers
 - Surface tension
 - Surface technology
 - Sacrificial effect
 - Surface too soft
 - Scanning electron microscope/ie
 - Scoring test
 - S-Nickel
 - Salt spray resistance / salt spray test
 - Sandblasting
 - Sealing
 - Silk matt surfaces
 - Selective coating
 - Silver
 - Silver hard / Silver soft
 - Sn - Tin
 - Sol-gel process
 - Stress corrosion cracking
 - Spectroscopy
 - Spray painting
 - Sputtering
 - Spreading ability
 - Substrate
 - Surfactants
 - Silver plating
 - Tarnishing
 - Thick film phosphating
 - Thin-film technology
 - Through-hole plating
 - Total measuring section
 - Tampon electroplating
 - Tape Test
 - Temperature-resistant surface
 - Temporary corrosion protection
 - Titanium
 - Transparent passivation
 - Tinning
 - Tartar
 - Tin (Sn)
 - Tensile stress
 - Tinder
 - Ultrafiltration
 - Ultrasonic cleaning
 - UV-resistant surface
 - UV weathering
 - Vibratory grinding
 - Verdigris
 - Voltage series of the elements
 - Vacuum coating process
 - Vanadium (V)
 - Velour nickel
 - Volt
 - Vickers hardness test method
 - Viennese lime
 - Water stains
 - Watts nickel electrolyte
 - Wetting
 - Wetting test
 - Weighting function
 - Wet process
 - Wetting agent
 - Wear-resistant surface
 - Whisker
 - White rust
 - X-ray fluorescence spectroscopy (XRF)
 - Yellow chromating
 - Yellow chromatography
 - Zinc
 - Zincate pickle
 - Zinc oxide (ZnO)
 
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